wire cutting
Material processing solutions
KOUKI Technology provides complete material processing services
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Material processing solutions
Diamond wire multi-edged wire cutting
Waterjet cutting
Material grinding outside
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One-stop OEM service
Cutting of hard and brittle materials (ceramics,sapphire, quartz, silicon, fluorescent ceramics)
Applicable materials
- Ceramics
- Silicon
- Sapphire
- Quartz
- Crystal
- Silicon carbide
- Glass
- Blue glass
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Other brittle and hard materials
OEM materials (actual results)
One-stop OEM service
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OEM service (cutting of hard and brittle materials) Diamond wire multi-blade wire cutting, combined with the ASE diamond wire saw cutting series, has efficiency and stability, which can maximize cutting quality. We also cater to custom size cutting requirements for molds, circles or rings with precision laser cutting services.
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Through the grinding of the material shape, diamond wire multi-blade wire cutting and slicing, and water jet cutting, the customized shape meets the needs of product mass production.
Sapphire wafer applications
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Microelectronics industry (such as: high Tc superconductors and microwave IC applications)
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Optoelectronic industry (for example: blue LED)
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laser diode
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Diameter: up to 6 inches