• High Purity Ultra-Fine Silica Powder
  • High Purity Ultra-Fine Silica Powder

High Purity Ultra-Fine Silica Powder

KOUKI is committed to providing high-quality and high-purity silica material solutions for advanced industrial applications.

Our High Purity Ultra-Fine Silica Powder features extremely low metallic impurities, consistent particle size distribution, and excellent whiteness. It is designed for use in semiconductor packaging materials, electronic fillers, PCB and CCL applications, thermal management materials, and other high-performance composite systems.

Through strict quality control and careful raw material selection, KOUKI delivers stable and reliable silica products that help customers improve product performance, quality, and long-term reliability.

Item Specification
Appearance White Powder
SiO₂ 99.9%
D50 1.2 μm
D100 2.86 μm
Moisture Content < 0.05%
Fe₂O₃ 0.01 ppm
Al₂O₃ 15 ppm
Na₂O 0.1 ppm
K₂O 0.1 ppm
CaO 0.1 ppm
MgO 0.1 ppm
pH Value 6.6
Whiteness 97.1%

Specification based on product test report.

High Purity

SiO₂ content up to 99.9%, suitable for electronic-grade and advanced industrial applications.

Ultra-Low Metallic Impurities

Extremely low iron and alkali metal content helps reduce contamination risks and improve product reliability.

Ultra-Fine Particle Size

Average particle size (D50) of approximately 1.2 μm provides excellent filling efficiency and material uniformity.

High Whiteness

Whiteness above 97%, suitable for applications requiring superior appearance and purity.

Consistent Batch Quality

Strict quality management ensures stable production and batch-to-batch consistency.

Sustainable Material Solution

Combining resource recycling and material upgrading technologies to provide environmentally friendly and cost-effective silica solutions.

Why Choose KOUKI

Advanced Silica Materials Supplier

KOUKI specializes in the development and supply of high-performance silica materials, including:

  • High Purity Quartz Lumps
  • Ultra-Fine Silica Powder
  • Spherical Silica Powder
  • Electronic Grade Silica Materials
  • Semiconductor Raw Materials
  • Recycled High Purity Silica Products

Our mission is to become a trusted global supplier of advanced silica materials for the electronics, semiconductor, and high-tech industries.

Industries We Serve

Semiconductor

Advanced Packaging • EMC • IC Assembly

Electronics

PCB • CCL • Electronic Components

AI & Data Centers

Thermal Management • High Reliability Materials

Industrial Applications

Coatings • Composites • Specialty Fillers

Sustainable High-Purity Silica Solutions

KOUKI is dedicated to creating value through sustainable resource utilization and advanced material processing technologies.

By integrating recycling, purification, and particle engineering capabilities, we provide customers with environmentally responsible silica solutions without compromising quality or performance.

Semiconductor Packaging Materials (EMC)

Used as a functional filler in Epoxy Molding Compounds (EMC) to improve thermal resistance, dimensional stability, and mechanical strength.


PCB & Copper Clad Laminates (CCL)

Enhances insulation performance, thermal stability, and reliability in advanced PCB and CCL applications.


AI Servers & High-Performance Computing

Suitable for advanced thermal management materials used in AI servers, data centers, and high-performance electronic systems.


Thermal Management Materials

Applicable to thermal interface materials (TIM), thermal adhesives, thermal pads, and heat dissipation systems.


High-Performance Coatings & Composites

Improves wear resistance, weatherability, dimensional stability, and surface quality in specialty coatings and composite materials.